Temperature distribution
Locate hot and cold regions and assess thermal nonuniformity through temperature gradients.
THERMAL ANALYSIS
Connect temperature fields to
thermal deformation.
Thermal analysis calculates how heat generation, cooling, conduction, and convection affect a product. UGPIA provides a consistent foundation for transferring temperature fields into structural models to evaluate thermal deformation and stress.
01Heat source · environment
02Conduction · convection · radiation
03Thermal solver
04Temperature · deformation · stress
ANALYSIS SCOPE
What the analysis evaluates
Heat transfer paths
Separate solid conduction, boundary convection, and radiation effects to understand how heat moves.
Thermal deformation and stress
Transfer the temperature field to a structural model to review expansion, alignment error, and thermal stress.
PROCESS
Thermal analysis workflow
Thermal analysis calculates how heat generation, cooling, conduction, and convection affect a product. UGPIA provides a consistent foundation for transferring temperature fields into structural models to evaluate thermal deformation and stress.
- 01
Define heat sources
Document component heat generation, heater conditions, and operating states.
- 02
Configure boundaries
Apply contact resistance, convection coefficients, ambient temperature, and insulation.
- 03
Solve temperature field
Calculate temperature and heat flux using steady-state or transient thermal analysis.
- 04
Review coupled response
Transfer temperatures to the structural model and compare deformation and stress with criteria.
APPLICATIONS
Typical applications
- Semiconductor heaters, chucks, and chambers
- Battery modules and cooling structures
- Precision stages and optical equipment
- High-temperature piping and pressure equipment
FAQ
Frequently asked questions
Which boundary conditions matter most?
Contact resistance, convection coefficients, ambient temperature, and cooling conditions can be as influential as heat generation. Test or operating data should support them where possible.
How are thermal and deformation analyses connected?
The calculated temperature field is transferred as a structural temperature load. Thermal expansion properties and constraints are then used to calculate deformation and stress.
CONTACT UGPIA
Discuss your analysis objective with us.
Contact UGPIA about CAE workflows and technical collaboration.