Structural stiffness and deformation
Review equipment deformation and relative position changes caused by gravity, vacuum, fastening, and operating loads.
SEMICONDUCTOR EQUIPMENT CAE
Validate semiconductor equipment
through structure and heat.
Semiconductor equipment performance depends on stiffness, temperature uniformity, and minute thermal deformation. UGPIA is designed to manage structural and thermal conditions and results for chambers, chucks, heaters, and wafer stages in a shared Analysis Model.
01Chamber · chuck · stage
02Vacuum · load · heat · cooling
03Structural · thermal
04Deformation · uniformity · accuracy
ANALYSIS SCOPE
What the analysis evaluates
Temperature uniformity
Evaluate temperature distribution across chucks and stages under heater and cooling conditions.
Thermal deformation and alignment
Combine structural and thermal results to assess wafer flatness, alignment error, and joint stress.
PROCESS
Semiconductor equipment CAE workflow
Semiconductor equipment performance depends on stiffness, temperature uniformity, and minute thermal deformation. UGPIA is designed to manage structural and thermal conditions and results for chambers, chucks, heaters, and wafer stages in a shared Analysis Model.
- 01
Define equipment scope
Organize chambers, chucks, heaters, stages, fasteners, and contacts for the analysis objective.
- 02
Configure operation
Define vacuum pressure, bolt loads, heat generation, cooling, ambient temperature, and supports.
- 03
Run multiphysics studies
Perform structural and thermal analysis and transfer temperature fields when required.
- 04
Evaluate accuracy
Compare deformation and temperature uniformity with process targets, tolerances, and measurement locations.
APPLICATIONS
Typical applications
- Process chambers
- Electrostatic and vacuum chucks
- Heater assemblies
- Wafer stages and transfer modules
FAQ
Frequently asked questions
Why combine structural and thermal analysis?
A structure can have sufficient static stiffness while nonuniform temperature still causes precision errors. Both responses must be connected to evaluate process accuracy.
Which criteria should be used?
In addition to allowable stress, use performance criteria such as wafer flatness, relative displacement, temperature uniformity, and assembly tolerances.
CONTACT UGPIA
Discuss your analysis objective with us.
Contact UGPIA about CAE workflows and technical collaboration.